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TLC2872ZP Datasheet(PDF) 16 Page - Texas Instruments |
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TLC2872ZP Datasheet(HTML) 16 Page - Texas Instruments |
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16 / 17 page ![]() TLC2872Z, TLC2872Y Advanced LinCMOS ™ RAIL-TO-RAIL DUAL OPERATIONAL AMPLIFIERS SLOS117 – OCTOBER 1992 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using PSpice ™ Parts™ model generation software. The Boyle macromodel (see Note 5) and subcircuit in Figure 20 were generated using the TLC2872Z typical electrical and operating characteristics at TA = 25°C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): D Maximum positive output voltage swing D Maximum negative output voltage swing D Slew rate D Quiescent power dissipation D Input bias current D Open-loop voltage amplification D Unity gain frequency D Common-mode rejection ratio D Phase margin D DC output resistance D AC output resistance D Short-circuit output current limit NOTE 5: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal of Solid-State Circuits, SC-9, 353 (1974). OUT + – + – + – + – + – + – + – + – + – RD1 60 11 2.653E3 RD2 60 12 2.653E3 R01 8 5 50 R02 7 99 50 RP 3 4 4.310E3 RSS 10 99 925.9E3 VAD 60 4 –.5 VB 9 0 DC 0 VC 3 53 DC .78 VE 54 4 DC .78 VLIM 7 8 DC 0 VLP 91 0 DC 1.9 VLN 0 92 DC 9.4 .MODEL DX D(IS=800.0E–18) .MODELJXPJF(IS=1.500E–12BETA=1.316E3 + VTO=–.270) .ENDS VCC + RP IN – 2 IN+ 1 VCC – VAD RD1 11 J1 J2 10 RSS ISS 3 12 RD2 60 VE 54 DE DP VC DC 4 C1 53 R2 6 9 EGND VB FB C2 GCM GA VLIM 8 5 RO1 RO2 HLIM 90 DIP 91 DIN 92 VIN VIP 99 7 . SUBCKT TLC2872 1 2 3 4 5 C1 11 12 14E–12 C2 6 7 60.00E–12 DC 5 53 DX DE 54 5 DX DLP 90 91 DX DLN 92 90 DX DP 4 3 DX EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5 FB 7 99 POLY (5) VB VC VE VLP VLN 0 + 984.9E3 –1E6 1E6 1E6 –1E6 GA 6 0 11 12 377.0E–6 GCM 0 6 10 99 134E–9 ISS 3 10 DC 216.OE–6 HLIM 90 0 VLIM 1K J1 11 2 10 JX J2 12 1 10 JX R2 6 9 100.OE3 Figure 20. Boyle Macromodel and Subcircuit Macromodels, simulation models, or other models provided by TI, directly or indirectly, are not warranted by TI as fully representing all of the specification and operating characteristics of the semiconductor product to which the model relates. PSpice and Parts are trademarks of MicroSim Corporation. |
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