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TMS570LS1114 Datasheet(PDF) 155 Page - Texas Instruments |
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TMS570LS1114 Datasheet(HTML) 155 Page - Texas Instruments |
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155 / 169 page ![]() Full Part # TMS 570 LS 11 1 4 B ZWT Q Q1 R Orderable Part # TMX 570 11 1 4 B ZWT Q Q1 R Prefix: TM TMS = Fully Qualified TMP = Prototype TMX = Samples Core Technology: 570 = Cortex R4F Architecture: LS = Dual CPUs in Lockstep (not included in orderable part #) Flash Memory Size: 11 = 1MB RAM MemorySize: 1 = 128kB Peripheral Set: 4 = no FlexRay, no Ethernet Die Revision: A = Die Revision A B = Die Revision B Package Type: ZWT = 337-Pin Plastic BGA with pb-free solder ball PGE = 144 Pin Plastic Quad Flatpack Temperature Range: Q = -40...+125 C o Quality Designator: Q1 = Automotive Shipping Options: R = Tape and Reel TMS570LS1114 www.ti.com SPNS188B – OCTOBER 2012 – REVISED FEBRUARY 2015 Figure 8-1. TMS570LS1114 Device Numbering Conventions Copyright © 2012–2015, Texas Instruments Incorporated Device and Documentation Support 155 Submit Documentation Feedback Product Folder Links: TMS570LS1114 |
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