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TMS570LS3137 Datasheet(PDF) 46 Page - Texas Instruments

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Part # TMS570LS3137
Description  TMS570LS3137 16- and 32-Bit RISC Flash Microcontroller
PDF  173 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMS570LS3137 Datasheet(HTML) 46 Page - Texas Instruments

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TMS570LS3137
SPNS162C – APRIL 2012 – REVISED APRIL 2015
www.ti.com
5.9
Thermal Resistance Characteristics
Table 5-2 shows the thermal resistance characteristics for the QFP - PGE mechanical package.
Table 5-3 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.
Table 5-2. Thermal Resistance Characteristics (PGE Package)
°C / W
Junction-to-free air thermal resistance, Still air using JEDEC 2S2P test
R
ΘJA
39
board
R
ΘJB
Junction-to-board thermal resistance
26.3
R
ΘJC
Junction-to-case thermal resistance
6.7
ΨJT
Junction-to-package top, Still air
0.10
Table 5-3. Thermal Resistance Characteristics (ZWT Package)
°C / W
Junction-to-free air thermal resistance, Still air (includes 5x5 thermal via
R
ΘJA
18.8
cluster in 2s2p PCB connected to 1st ground plane)
R
ΘJB
Junction-to-board thermal resistance
14.1
R
ΘJC
Junction-to-case thermal resistance
7.1
Junction-to-package top, Still air (includes 5x5 thermal via cluster in 2s2p
ΨJT
0.33
PCB connected to 1st ground plane)
46
Specifications
Copyright © 2012–2015, Texas Instruments Incorporated
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