7

ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC

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SLLSEI6F – SEPTEMBER 2014 – REVISED AUGUST 2016

Product Folder Links: ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC

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Copyright © 2014–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak

voltage values.

(3)

Maximum voltage must not exceed 6 V.

7 Specifications

7.1 Absolute Maximum Ratings

See

(1)

MIN

MAX

UNIT

–0.5

6

V

Voltage

INx, OUTx, ENx

–0.5

(3)

V

Output current

±15

mA

Maximum junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

Charged device model (CDM), per JEDEC specification JESD22-

±1500

V

(1)

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

3

5.5

V

High-level output current

–4

mA

Low-level output current

4

mA

High-level input voltage

2

5.5

V

Low-level input voltage

0

0.8

V

Input pulse duration

40

ns

Signaling rate

0

25

Mbps

136

°C

Ambient temperature

–40

25

125

°C