NLAST4501

http://onsemi.com

2

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

Positive DC Supply Voltage

*0.5 to )7.0

V

Digital Input Voltage (Enable)

*0.5 to )7.0

V

V

DC Current, Into or Out of Any Pin

$20

mA

Storage Temperature Range

*65 to )150

_C

Lead Temperature, 1 mm from Case for 10 Seconds

260

_C

Junction Temperature under Bias

)150

_C

Thermal Resistance

SC70−5/SC−88A (Note 1)

TSOP−5

350

230

_C/W

Power Dissipation in Still Air at 85

_C

SC70−5/SC−88A

TSOP−5

150

200

mW

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 30% − 35%

UL−94−VO (0.125 in)

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 100

N/A

V

Latch−Up Performance

$300

mA

Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those

indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions is not implied. Functional

operation should be restricted to the Recommended Operating Conditions.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

Positive DC Supply Voltage

2.0

5.5

V

Digital Input Voltage (Enable)

GND

5.5

V

Static or Dynamic Voltage Across an Off Switch

GND

V

Analog Input Voltage (NO, COM)

GND

V

Operating Temperature Range, All Package Types

*55

)125

_C

Input Rise or Fall Time,

(Enable Input)

0

0

100

20

ns/V

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 2. Failure Rate vs. Time Junction Temperature

TIME, YEARS