OPA690

2

SBOS223A

www.ti.com

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA690ID

SO-8

D

–40

°C to +85°C

OPA690

OPA690ID

Rails, 100

"

"""

"

OPA690IDR

Tape and Reel, 2500

OPA690IDBV

SOT23-6

DBV

–40

°C to +85°C

OAEI

OPA690IDBVT

Tape and Reel, 250

"

"""

"

OPA690IDBVR

Tape and Reel, 3000

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

1

2

3

4

8

7

6

5

NC

Inverting Input

Noninverting Input

–V

S

DIS

+V

S

Output

NC

PIN CONFIGURATIONS

Top View

SO

Power Supply ...............................................................................

±6.5V

DC

Internal Power Dissipation .................................... See Thermal Analysis

Differential Input Voltage ..................................................................

±1.2V

Input Voltage Range ...........................................................................

±V

S

Storage Temperature Range: D, DBV ........................... –40

°C to +125°C

Lead Temperature (soldering, 10s) .............................................. +300

°C

ESD Resistance: HBM .................................................................... 2000V

MM ........................................................................ 200V

CDM .................................................................... 1500V

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

Top View

SOT23

PACKAGE/ORDERING INFORMATION

1

2

3

6

5

4

Output

–V

S

Noninverting Input

+V

S

DIS

Inverting Input

OAEI

Pin Orientation/Package Marking

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.