DAC7513

2

SBAS157A

www.ti.com

Operating Temperature Range ...................................... –40

°C to +105°C

Storage Temperature Range ......................................... –65

°C to +150°C

SOT23 Package:

θ

Lead Temperature, Soldering:

Vapor Phase (60s) ............................................................... +215

°C

Infrared (15s) ........................................................................ +220

°C

MSOP Package:

θ

θ

Lead Temperature, Soldering:

Vapor Phase (60s) ............................................................... +215

°C

Infrared (15s) ........................................................................ +220

°C

NOTE: (1) Stresses above those listed under

Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

PIN CONFIGURATIONS

PACKAGE/ORDERING INFORMATION

MINIMUM

RELATIVE

DIFFERENTIAL

SPECIFICATION

ACCURACY NONLINEARITY

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

(LSB)

(LSB)

PACKAGE-LEAD

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

DAC7513E

±8

±1

MSOP-8

DGK

–40

°C to +105°C

D13E

DAC7513E/250

Tape and Reel, 250

"

"

""

""

"

DAC7513E/2K5

Tape and Reel, 2500

DAC7513N

±8

±1

SOT23-8

DCN

–40

°C to +105°C

D13N

DAC7513N/250

Tape and Reel, 250

"

"

""

""

"

DAC7513N/3K

Tape and Reel, 3000

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

Top View

SOT23-8

MSOP-8

V

OUT

V

FB

V

REF

V

DD

SYNC

SCLK

D

IN

GND

1

2

3

4

8

7

6

5

DAC7513

V

DD

V

REF

V

FB

V

OUT

GND

D

IN

SCLK

SYNC

1

2

3

4

8

7

6

5

DAC7513

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.