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ST72561 Datasheet(PDF) 252 Page - STMicroelectronics

Part # ST72561
Description  8-BIT MCU WITH FLASH OR ROM, 10-BIT ADC, 5 TIMERS, SPI, LINSCI , ACTIVE CAN
PDF  262 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72561 Datasheet(HTML) 252 Page - STMicroelectronics

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PACKAGE CHARACTERISTICS (Cont’d)
Figure 152. 32-Pin Thin Quad Flat Package
13.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
Dim.
mm
inches
Min
Typ
Max
Min
Typ
Max
A
1.60
0.063
A1
0.05
0.15 0.002
0.006
A2
1.35
1.40
1.45 0.053 0.055 0.057
b
0.30
0.37
0.45 0.012 0.015 0.018
C
0.09
0.20 0.004
0.008
D
9.00
0.354
D1
7.00
0.276
E
9.00
0.354
E1
7.00
0.276
e
0.80
0.031
θ
0°
3.5°
7°
0°
3.5°
7°
L
0.45
0.60
0.75 0.018 0.024 0.030
L1
1.00
0.039
Number of Pins
N
32
h
c
L
L1
b
e
A1
A2
A
E
E1
D
D1
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient)
TQFP64
TQFP44
TQFP32
60
52
70
°C/W
PD
Power dissipation 1)
500
mW
TJmax
Maximum junction temperature 2)
150
°C



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