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DMC3016LSD Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMC3016LSD
Description  COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
PDF  10 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMC3016LSD Datasheet(HTML) 2 Page - Diodes Incorporated

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DMC3016LSD
Document Number: DS36935 Rev. 4 - 2
2 of 10
www.diodes.com
December 2015
© Diodes Incorporated
DMC3016LSD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value Q1
Value Q2
Units
Drain-Source Voltage
VDSS
30
-30
V
Gate-Source Voltage
VGSS
±20
±20
V
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
TA = +25°C
TA = +70°C
ID
8.2
6.5
-6.2
-5.0
A
t<10s
TA = +25°C
TA = +70°C
ID
10.5
8.4
-8.0
-6.4
A
Maximum Body Diode Forward Current (Note 6)
IS
2.5
-2.5
A
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
IDM
80
-40
A
Avalanche Current (Note 7) L = 0.1mH
IAS
22
-22
A
Avalanche Energy (Note 7) L = 0.1mH
EAS
25
25
mJ
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
TA = +25°C
PD
1.2
W
TA = +70°C
0.8
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
102
°C/W
t<10s
62
Total Power Dissipation (Note 6)
TA = +25°C
PD
1.6
W
TA = +70°C
1.0
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
78
°C/W
t<10s
47
Thermal Resistance, Junction to Case (Note 6)
RθJC
12
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (N-Channel Q1) (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
30
—
—
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current
IDSS
—
—
1
μA
VDS = 30V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(th)
1.0
—
3.0
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
—
12
16
m
Ω
VGS = 10V, ID = 12A
—
15
20
VGS = 4.5V, ID = 10A
Diode Forward Voltage
VSD
—
0.7
1.0
V
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
CISS
—
1,415
—
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
COSS
—
119
—
Reverse Transfer Capacitance
CRSS
—
82
—
Gate Resistance
RG
—
2.6
3.2
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
Total Gate Charge (VGS = 4.5V)
QG
—
11.3
—
nC
VDS = 15V, ID = 12A
Total Gate Charge (VGS = 10V)
QG
—
25.1
—
Gate-Source Charge
QGS
—
3.5
—
Gate-Drain Charge
QGD
—
3.6
—
Turn-On Delay Time
tD(ON)
—
4.8
—
ns
VDD = 15V, VGS = 10V,
RL = 1.25Ω, RG = 3Ω,
Turn-On Rise Time
tR
—
16.5
—
Turn-Off Delay Time
tD(OFF)
—
26.1
—
Turn-Off Fall Time
tF
—
5.6
—
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. UIS in production with L = 0.1mH, starting TA = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.



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