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DMC3016LSD Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMC3016LSD Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 10 page ![]() DMC3016LSD Document Number: DS36935 Rev. 4 - 2 2 of 10 www.diodes.com December 2015 © Diodes Incorporated DMC3016LSD Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Q1 Value Q2 Units Drain-Source Voltage VDSS 30 -30 V Gate-Source Voltage VGSS ±20 ±20 V Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 8.2 6.5 -6.2 -5.0 A t<10s TA = +25°C TA = +70°C ID 10.5 8.4 -8.0 -6.4 A Maximum Body Diode Forward Current (Note 6) IS 2.5 -2.5 A Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%) IDM 80 -40 A Avalanche Current (Note 7) L = 0.1mH IAS 22 -22 A Avalanche Energy (Note 7) L = 0.1mH EAS 25 25 mJ Thermal Characteristics Characteristic Symbol Value Units Total Power Dissipation (Note 5) TA = +25°C PD 1.2 W TA = +70°C 0.8 Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 102 °C/W t<10s 62 Total Power Dissipation (Note 6) TA = +25°C PD 1.6 W TA = +70°C 1.0 Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 78 °C/W t<10s 47 Thermal Resistance, Junction to Case (Note 6) RθJC 12 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (N-Channel Q1) (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage BVDSS 30 — — V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current IDSS — — 1 μA VDS = 30V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage VGS(th) 1.0 — 3.0 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) — 12 16 m Ω VGS = 10V, ID = 12A — 15 20 VGS = 4.5V, ID = 10A Diode Forward Voltage VSD — 0.7 1.0 V VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance CISS — 1,415 — pF VDS = 15V, VGS = 0V, f = 1.0MHz Output Capacitance COSS — 119 — Reverse Transfer Capacitance CRSS — 82 — Gate Resistance RG — 2.6 3.2 Ω VDS = 0V, VGS = 0V, f = 1.0MHz Total Gate Charge (VGS = 4.5V) QG — 11.3 — nC VDS = 15V, ID = 12A Total Gate Charge (VGS = 10V) QG — 25.1 — Gate-Source Charge QGS — 3.5 — Gate-Drain Charge QGD — 3.6 — Turn-On Delay Time tD(ON) — 4.8 — ns VDD = 15V, VGS = 10V, RL = 1.25Ω, RG = 3Ω, Turn-On Rise Time tR — 16.5 — Turn-Off Delay Time tD(OFF) — 26.1 — Turn-Off Fall Time tF — 5.6 — Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate. 7. UIS in production with L = 0.1mH, starting TA = +25°C. 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. |
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