 2015 Microchip Technology Inc.

DS20005357A-page 5

CL8800

2.0

PIN DESCRIPTION

The locations of the pins are listed in Package Type.

TABLE 2-1:

PIN DESCRIPTION

Pin #

Function

Description

1 - 8

GND

Circuit common (use for heat sink ground plane pass through).

9SET1

Current sense for linear current regulators for each tap. Resistors on these pins

sets the tap currents.

10

NC

No internal connection.

11

SET2

Current sense for linear current regulators for each tap. Resistors on these pins

sets the tap currents.

12

NC

No internal connection.

13

SET3

Current sense for linear current regulators for each tap. Resistors on these pins

sets the tap currents.

14

NC

No internal connection.

15

SET4

Current sense for linear current regulators for each tap. Resistors on these pins

sets the tap currents.

16

NC

No internal connection.

17

SET5

Current sense for linear current regulators for each tap. Resistors on these pins

sets the tap currents.

18

SET6

Current sense for linear current regulators for each tap. Resistors on these pins

sets the tap currents.

19 - 20

GND

Circuit common (use for heat sink ground plane pass through).

21

GND

Circuit common. Connect to bridge rectifier return (use for heat sink ground plane

pass through).

22 - 26

GND

Circuit common (use for heat sink ground plane pass through).

27

TAP6

Current regulator outputs. Connect to taps along the LED string.

28

TAP5

29

TAP4

30

TAP3

31

TAP2

32

TAP1

33

BIAS

Provides bias for driver. Connect to rectified AC.

Underside plate

(GND)

For heat sinking purposes, it should be soldered to a 4.0cm2 exposed copper

area. It should also be electrically connected to circuit common (GND).