MRF89XAM8AT-ISLASHRM datasheet(16/34 Pages) MICROCHIP

16 / 34 page

MRF89XAM8A

DS70651A-page 14

Preliminary

FIGURE 2-9:

PCB LAYER STACK UP

2.3

PCB Antenna

The PCB antenna is fabricated on the top copper trace.

Figure 2-10 illustrates the trace dimensions. The layers

below the antenna have no copper traces. The ground

and power planes under the components serve as a

counterpoise to the PCB antenna. Additional ground

plane on the host PCB will substantially enhance the

performance of the module. For best performance,

place the module on the host PCB by following the

recommendations given in the Section 1.2, Mounting

Details.

The PCB antenna was designed and simulated using

Ansoft Designer® and HFSS™ 3D full-wave solver

software by ANSYS Inc. (www.ansoft.com). The goal of

the design was to create a compact, low-cost antenna

with the best radiation pattern. Figure 2-11 illustrates

the

simulation

drawing

and

Figure 2-12

and

Figure 2-13 illustrates the 2D and 3D radiation

patterns. As shown by the radiation patterns, the

performance of the antenna is dependant upon the

orientation of the module. Figure 2-14 illustrates the

impedance simulation and Figure 2-15 illustrates the

simulated PCB antenna VSWR. The discrete matching

circuitry matches the impedance of the antenna with

the SAW filter and MRF89XA transceiver IC.

FIGURE 2-10:

PCB ANTENNA

DIMENSIONS

Top Copper

Ground Plane

Power Plane

Bottom Copper

1/2 oz. Copper

8 mil FR4

12 mil FR4

8 mil FR4

0.032”

± 0.005”

16.8mm

1.0mm

8.4mm

1.1mm

0.5mm

2.5mm

MRF89XAM8AT-I/RM Datasheet(PDF) 16 Page - Microchip Technology

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