RN1723 datasheet(8/32 Pages) MICROCHIP

Part #	RN1723

Description	2.4 GHz IEEE Std. 802.11 b/g Wireless LAN Module

PDF	32 Pages

Scroll/Zoom	100%

Manufacturer	MICROCHIP [Microchip Technology]

Direct Link	http://www.microchip.com

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8 / 32 page

RN1723

DS70005224A-page 8

 2015 Microchip Technology Inc.

1.4

Soldering Recommendations

The RN1723 wireless module was assembled using

the IPC/JEDEC J-STD-020 Standard lead-free reflow

profile. However, the RN1723 module can be soldered

to the host PCB using standard leaded and lead-free

solder reflow profiles.

To avoid damaging the module, it is recommended to

adhere to the following:

• Solder reflow recommendations are provided in

the Microchip application note, AN233 “Solder

Reflow Recommendation” (DS00233)

• Do not exceed a peak temperature (TP) of 250°C

• Refer to the vendor’s solder paste data sheet for

specific reflow profile recommendations

• Use no-clean flux solder paste

• Do not wash, as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

RN1723 Datasheet(PDF) 8 Page - Microchip Technology