ADP1763ACPZ0.95-R7 datasheet(17/19 Pages) AD

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ADP1763

Data Sheet

Rev. 0 | Page 16 of 18

TJ MAX

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

VIN – VOUT (V)

500mA

10mA

100mA

Figure 38. 6400 mm2 of PCB Copper, TA = 50°C

TJ MAX

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

500mA

10mA

100mA

Figure 39. 500 mm2 of PCB Copper, TA = 50°C

TJ MAX

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

500mA

10mA

100mA

Figure 40. 25 mm2 of PCB Copper, TA = 50°C

In cases where the board temperature is known, the thermal

characterization parameter (ΨJB) can be used to estimate the

junction temperature rise. The maximum junction temperature

(TJ) is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(8)

Figure 41 through Figure 44 show junction temperature calculations

for different board temperatures, load currents, VIN to VOUT

differentials, and areas of PCB copper.

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

500mA

10mA

100mA

TJ MAX

Figure 41. 500 mm2 of PCB Copper, TB = 25°C

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.2

1.4

1.6

TJ MAX

500mA

10mA

100mA

Figure 42. 500 mm2 of PCB Copper, TB = 50°C

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

500mA

10mA

100mA

TJ MAX

Figure 43. 1000 mm2 of PCB Copper, TB = 25°C

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