 2002 Microchip Technology Inc.

DS21615B-page 5

TCM811/TCM812

3.0

TYPICAL PERFORMANCE CHARACTERISTICS

FIGURE 3-1:

Supply Current vs. Temperature.

FIGURE 3-2:

Power-Down

Reset

Delay

vs.

Temperature.

FIGURE 3-3:

Power-Up

Reset

Timeout

vs.

Temperature.

FIGURE 3-4:

Supply Current vs. Temperature.

FIGURE 3-5:

Power-Down

Reset

Delay

vs.

Temperature.

FIGURE 3-6:

Power-Down

Reset

Delay

vs.

Temperature.

Note:

The graphs provided following this note are a statistical summary based on a limited number of samples

and are provided for informational purposes only. The performance characteristics listed herein are not

tested or guaranteed. In some graphs, the data presented may be outside the specified operating range

(e.g., outside specified power supply range) and therefore outside the warranted range.

TEMPERATURE (˚C)

8

10

12

14

6

4

2

0

–40

0

20

–20

40

60

85

TCM81xR/S/T/F

No Load

TEMPERATURE (˚C)

30

40

50

20

10

0

–40

0

20

–20

40

60

85

TCM81xF

TEMPERATURE (˚C)

240

245

250

235

230

225

–40

0

20

–20

40

60

85

TCM81xL/M

TCM81xR/S/T/F

8

6

4

2

0

TEMPERATURE (˚C)

–40

0

20

–20

40

60

85

TCM81xL/M

No Load

TEMPERATURE (˚C)

30

40

50

20

10

0

–40

0

20

–20

40

60

85

V

V

V

TCM81xL/M

TEMPERATURE (˚C)

30

40

50

20

10

0

–40

0

20

–20

40

60

85

V

V

V

TCM81x/R/S/T