MPX5500 SERIES

3

Motorola Sensor Device Data

Figure 3 illustrates the Differential/Gauge basic chip carrier

(Case 867). A fluorosilicone gel isolates the die surface and

wire bonds from the environment, while allowing the pres-

sure signal to be transmitted to the sensor diaphragm. (For

use of the MPX5500D in a high pressure, cyclic application,

consult the factory.)

The MPX5500 series pressure sensor operating charac-

teristics, and internal reliability and qualification tests are

based on use of dry air as the pressure media. Media, other

than dry air, may have adverse effects on sensor perfor-

mance and long–term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 2 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

85

output will saturate outside of the specified pressure range.

Figure 4 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D in-

put of a microprocessor or microcontroller. Proper decoup-

ling of the power supply is recommended.

MAX

Figure 2. Output versus Pressure Differential

DIFFERENTIAL PRESSURE (kPa)

5.0

4.0

3.0

2.0

0

550

350

150

0

450

250

4.5

3.5

2.5

1.5

50

TRANSFER FUNCTION:

TEMP = 0 to 85°C

1.0

0.5

500

300

100

400

200

MIN

TYPICAL

FLUORO SILICONE

DIE COAT

LEAD

FRAME

STAINLESS STEEL

METAL COVER

RTV DIE

BOND

DIE

EPOXY CASE

WIRE BOND

Figure 3. Cross–Sectional Diagram

(Not to Scale)

P1

P2

Figure 4. Recommended power supply decoupling

and output filtering.

For additional output filtering, please refer to

Application Note AN1646.

1.0 mF

IPS

470 pF

OUTPUT

Vs

+5 V

0.01 mF

GND

Vout

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com