M95M02-DR datasheet(44/45 Pages) STMICROELECTRONICS

44 / 45 page

Revision history

M95M02-DR

44/45

DocID18203 Rev 10

15-Sep-2014

Updated WLCSP (CS) package figure on cover page.

Removed “Preliminary data” footnote from Figure 3, Figure 24 and

Table 16.

Removed note about exposure to UV light in Section 10: Package

information.

Updated Table 4: Instruction set, and removed footnotes from it.

Added Table 4: Significant bits within the address bytes and Figure 27:

WLCSP 8-bump wafer lenght chip-scale recommended land pattern.

Updated Note 1 in Table 12: Absolute maximum ratings.

Updated Table 15: AC characteristics and Table 18: Ordering information

scheme.

22-Jun-2015

Updated Features and WLCSP figure on cover page.

Updated Figure 3: WLCSP connections, Figure 4: Block diagram and

Figure 14: Page Write (WRITE) sequence.

Updated Section 5.1.3: Power-up conditions and Section 6: Instructions.

Added Table 2: Signals vs. bump position and updated Table 3: Write-

protected block size and footnotes of Table 8: Absolute maximum ratings.

Updated Section 10: Package information with changes in each of

Sections 10.1: SO8N package information and Section 10.2: WLCSP

package information.

Updated footnote 1 of Table 18: Ordering information scheme and added

Note: on Engineering samples.

Table 19. Document revision history (continued)

Date

Revision

Changes

M95M02-DR Datasheet(PDF) 44 Page - STMicroelectronics