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STM32L011E3 Datasheet(PDF) 99 Page - STMicroelectronics |
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STM32L011E3 Datasheet(HTML) 99 Page - STMicroelectronics |
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99 / 115 page  Package information STM32L011x3/4 99/115 DocID027973 Rev 4 Figure 40. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale package recommended footprint G - 0.235 - - 0.0093 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 71. WLCSP25 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm Table 70. WLCSP25 - 25-ball, 2.133 x 2.070 mm, 0.4 mm pitch wafer level chip scale package mechanical data (continued) |
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