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STM32L052C8 Datasheet(PDF) 121 Page - STMicroelectronics |
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STM32L052C8 Datasheet(HTML) 121 Page - STMicroelectronics |
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121 / 136 page  DocID025936 Rev 6 121/136 STM32L052x6 STM32L052x8 130 Figure 49. WLCSP36 - 2.596 x 2.868 mm, 0.4 mm pitch wafer level chip scale recommended footprint G - 0.434 - - 0.0171 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 86. WLCSP36 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed Table 85. WLCSP36 - 2.596 x 2.868 mm, 0.4 mm pitch wafer level chip scale mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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