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STM32L052K8 Datasheet(PDF) 115 Page - STMicroelectronics |
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STM32L052K8 Datasheet(HTML) 115 Page - STMicroelectronics |
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115 / 136 page ![]() DocID025936 Rev 6 115/136 STM32L052x6 STM32L052x8 130 Figure 43. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. e - 0.500 - - 0.0197 - F - 0.750 - - 0.0295 - ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 83. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 82. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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