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MGC3030 Datasheet(PDF) 34 Page - Microchip Technology |
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MGC3030 Datasheet(HTML) 34 Page - Microchip Technology |
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34 / 50 page ![]() MGC3030/3130 DS40001667D-page 34 Advance Information 2012-2015 Microchip Technology Inc. 6.0 APPLICATION ARCHITECTURE The standard MGC3X30 implementation is a single- zone design. This configuration is based on one MGC3X30 connected to an application host via I2C™ with MGC3X30 being Slave and Application Host being Master. A total of three lines are needed for the I2C interface (see Figure 6-1). Data reporting and flow-control scenarios are described below for I2C communication: •SDA •SCL • EIO0 (Transfer Status Line) is toggled indicating that new data is available and checking whether the host has already started data reading or not. FIGURE 6-1: APPLICATION CIRCUITRY 6.1 ESD Considerations The MGC3X30 provides Electrostatic Discharge (ESD) Voltage protection up to 2 kV (HBM). Additional ESD countermeasures may be implemented individually to meet application-specific requirements. 6.2 Power Noise Considerations MGC3X30 filtering capacitors are included in the reference design schematic (Please refer to Figure 6-2). 6.3 Irradiated High-Frequency Noise In order to suppress irradiated high-frequency signals, the five Rx channels of the chip are connected to the electrodes via serial 10 k resistors, as close as possible to MGC3X30. The 10 k resistor and the MGC3X30 input capacitance are building a low-pass filter with a corner frequency of 3 MHz. An Additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600 at 100 MHz). An additional ferrite bead is recommended to suppress the coupling of RF noise to the Tx channel (e.g., 600 at 100 MHz). 6.4 Reference Schematic (3.3V VDD 3.465V) The reference application schematic for the MGC3X30 is depicted below in Figure 6-2. MGC3x30 Host Controller SDA0 SCL0 EIO0 MCLR SDA SCL GPIO GPIO SDA SCL TS Vcc MCLR X |
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