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VP2450 Datasheet(PDF) 2 Page - Microchip Technology |
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VP2450 Datasheet(HTML) 2 Page - Microchip Technology |
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2 / 14 page ![]() VP2450 DS20005569A-page 2 2016 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Drain-to-source Voltage.........................................................................................................................................BVDSS Drain-to-gate Voltage ............................................................................................................................................BVDGS Gate-to-source Voltage ........................................................................................................................................... ±20V Operating and Storage Temperatures .................................................................................................. –55°C to +150°C † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Electrical Specifications: For all specifications, TA = TJ = +25°C unless otherwise noted. Parameter Sym. Min. Typ. Max. Unit Conditions DC PARAMETER (Note 1 unless otherwise stated) Drain-to-source Breakdown Voltage BVDSS –500 — — V VGS = 0V, ID = –250 µA Gate Threshold Voltage VGS(th) –1.5 — –3.5 V VGS = VDS, ID = –1 mA Change in VGS(th) with Temperature ∆VGS(th) — — –4.8 mV/°C VGS = VDS, ID = –1 mA (Note 2) Gate Body Leakage Current IGSS — — –100 nA VGS = ±20V, VDS = 0V Zero Gate Voltage Drain Current IDSS — — –10 µA VGS = 0V, VDS = Maximum Rating — — –1 mA VDS = 0.8 Maximum Rating, VGS = 0V, TA = 125°C (Note 2) On-state Drain Current ID(ON) –75 — — mA VGS = –4.5V, VDS = –15V –200 — — VGS = –10V, VDS = –15V Static Drain-to-source On-state Resistance RDS(ON) — — 35 Ω VGS = –4.5V, ID = –50 mA — — 30 VGS = –10V, ID = –100 mA Change in RDS(ON) with Temperature ∆RDS(ON) — — 0.75 %/°C VGS = –10V, ID = –100 mA (Note 2) AC PARAMETER (Note 2) Forward Transconductance GFS 150 320 — mmho VDS = –15V, ID = –100 mA Input Capacitance CISS — — 190 pF VGS = 0V, VDS = –25V, f = 1 MHz Common Source Output Capacitance COSS — — 75 Reverse Transfer Capacitance CRSS — — 20 Turn-on Delay Time td(ON) — — 10 ns VDD = –25V, ID = –200 mA, RGEN = 25Ω Rise Time tr — — 25 Turn-off Delay Time td(OFF) — — 45 Fall Time tf — — 25 DIODE PARAMETER Diode Forward Voltage Drop VSD — — –1.8 V VGS = 0V, ISD = –100 mA (Note 1) Reverse Recovery Time trr — 300 — ns VGS = 0V, ISD = –100 mA (Note 2) Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated. (Pulse test: 300 µs pulse, 2% duty cycle) 2: Specification is obtained by characterization and is not 100% tested. |
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