2003 Feb 05

13

Philips Semiconductors

Preliminary specification

Full bridge current driven vertical

deflection booster

TDA4867J

SOLDERING

Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual

soldering. A more in-depth account of soldering ICs can be

found in our

“Data Handbook IC26; Integrated Circuit

Packages” (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of

through-hole mount IC packages on a printed-circuit

board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is

260

°C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

The total contact time of successive solder waves must not

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300

°C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400

°C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

PACKAGE

SOLDERING METHOD

DIPPING

WAVE

DBS, DIP, HDIP, SDIP, SIL

suitable

suitable(1)