12/16

(Ver 1.0)

• Printed Circuit Board Assembled (PCB with LEDs soldered)

Do not stack assembled PCBs together. Since silicone is a soft material abrasion between two PCB assembled

with encapsulate LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as

scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment.

(6) Soldering Conditions

• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any

guarantee on the LEDs after they have been assembled using the dip soldering method.

• Recommended soldering conditions

Reflow Soldering

Reflow Soldering

Lead Solder

Lead-free Solder

Pre-Heat

Pre-Heat Time

Peak Temperature

Soldering Time

Condition

120~150℃

120sec Max.

240℃ Max.

10sec Max.

refer to profile ①

180~200℃

120sec Max.

260℃ Max.

10sec Max.

refer to profile ②

Temperature

Soldering Time

350℃ Max.

3sec Max.

(one time only)

* Although the recommended soldering conditions are specified in the above table, reflow soldering at the

lowest possible temperature is desirable for the LEDs.

* A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

[Temperature-Profile (surface of circuit board)]

Use the conditions shown to the following figures.

<① : Lead Solder>

<② : Lead-free Solder>