NEB-D datasheet(33/36 Pages) CUI

33 / 36 page

cui.com

date 06/10/2016

│ page 33 of 36

CUI Inc

│ SERIES: NEB-D │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS

Soldering Information - Hole Mounting

The hole mounted product is intended for plated through

hole mounting by wave or manual soldering. The pin

temperature is specified to maximum to 270°C for

maximum 10 seconds.

A maximum preheat rate of 4°C/s and maximum preheat

temperature of 150°C is suggested. When soldering by

hand, care should be taken to avoid direct contact between

the hot soldering iron tip and the pins for more than a few

seconds in order to prevent overheating.

A no-clean flux is recommended to avoid entrapment of

cleaning fluids in cavities inside the product or between

the product and the host board. The cleaning residues may

affect long time reliability and isolation voltage.

Delivery Package Information

The products are delivered in antistatic injection molded

trays (Jedec design guide 4.10D standard) and in antistatic

trays

Tray Specifications–SMD /Pin in paste

Material

Antistatic PPE

Surface resistance

105 < Ohm/square < 10

Bakability

The trays can be baked at maximum

125°C for 48 hours

Tray thickness

17.40mm0.685 [inch]

Box capacity

100products (5 full trays/box)

Tray weight

125g empty, 605g full tray

JEDEC standard tray for 2x5 = 10 products.

All dimensions in mm [inch]

Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005]

Note: pick up positions refer to center of pocket.

See mechanical drawing for exact location on product.

For more information, please visit the product page.

NEB-D Datasheet(PDF) 33 Page - CUI INC

NEB-D Datasheet(HTML) 33 Page - CUI INC

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