www.sensirion.com

November 2016 - Version 1

14/17

Figure 8 Recommended metal land pattern (left) and stencil apertures (right) for the STS3x-DIS. The dashed lines represent the

outer dimension of the DFN package. The PCB pads (left) and stencil apertures (right) are indicated through the shaded areas.

6 Shipping Package

Figure 9 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to the

left on this drawing. Dimensions are given in millimeters.

1

0.55

0.3x45°

0.2

0.75

0.9

0.55

0.55

0.8

0.3

land pattern

stencil aperture

sensor outline