© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1003_C0G • 3/30/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force:1.0Kgminimum.

2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:

Tape Width

Peel Strength

8 mm

0.1to1.0Newton(10to100gf)

12 and 16 mm

0.1to1.3Newton(10to130gf)

Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe165°to180°

fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof300±10mm/minute.

3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

Ao

Bo

°

T

°

s

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape

Maximum

8,12

20

16 – 200

10

Tape

Maximum

8,12

20

16 – 56

10

72 – 200

5

Typical Pocket Centerline

Typical Component Centerline

Figure 4 – Maximum Lateral Movement

0.5 mm maximum

0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum

1.0 mm maximum

16 mm Tape

Figure 5 – Bending Radius

R

R

Bending

Radius

Embossed

Carrier

Punched

Carrier