ADM7172ACPZ-3.0-R7 datasheet(6/24 Pages) AD

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Data Sheet

ADM7172

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN to GND

−0.3 V to +7 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to +7 V

SS to GND

−0.3 V to VIN

SENSE to GND

−0.3 V to +7 V

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADM7172 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient temperature

does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

need to be derated.

In applications with moderate power dissipation and low

printed circuit board (PCB) thermal resistance, the maximum

ambient temperature can exceed the maximum limit provided

that the junction temperature is within specification limits. The

junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA).

Maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using the

formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required.

The value of θJA may vary, depending on PCB material, layout, and

environmental conditions. The specified values of θJA are based

on a 4-layer, 4 in. × 3 in. circuit board. See JESD51-7 and

JESD51-9 for detailed information on the board construction.

For additional information, see the AN-617 Application Note,

Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information, states

that thermal characterization parameters are not the same as

thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation from

the package, factors that make ΨJB more useful in real-world

applications. Maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD)

using the formula

TJ = TB + (PD × ΨJB)

See JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA, θJC, and ΨJB are specified for the worst-case conditions, that

is, a device soldered in a circuit board for surface-mount

packages.

Table 5. Thermal Resistance

Package Type

θJA

θJC

ΨJB

Unit

8-Lead LFCSP

36.4

23.5

13.3

°C/W

ESD CAUTION

Rev. C | Page 5 of 23

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