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MGA-231T6 Datasheet(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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MGA-231T6 Datasheet(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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2 / 15 page ![]() 2 Absolute Maximum Rating[1] TA = 25°C Symbol Parameter Units Absolute Max. Vdd Device Drain to Source Voltage[2] V 3.6 Idd Drain Current[2] mA 15 Pin,max CW RF Input Power (Vdd = 2.7V, Idd = 6mA) dBm 13 Pdiss Total Power Dissipation[4] mW 54 Tc[5] Recommended Operating Temperature[6] °C -40 to +85 Tj Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 Notes: 1. Operation of this device in excess of any of these limits may cause permanent damage. 2. Assuming DC quiescent conditions. 3. Thermal resistance measured using Infra-Red measurement technique. 4. Board (module belly) temperature TB is 25°C. Derate 6.63 mW/°C for Tb > 141.86°C 5. Tc is defined as case temperature, the temperature of the underside of the device where it makes contact with the circuit board 6. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet the electrical specification. Thermal Resistance [3] (Vdd = 2.85V, Vsd = 1.8V, Idd = 4mA), jc = 150.8°C/W |
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