SGGP.25.4.A.02

6.

Recommended Reflow Soldering Profile

SGGP.25A can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C,

the temperature profile suggested is as follows:

Phase

Profile Features

Pb-Free Assembly (SnAgcu)

PREHEAT

Temperature Min(Tsmin)

150°C

Temperature Max(Tsmax)

200°C

Time(ts) from (Tsmin to Tsmax)

60-120 seconds

RAMP-UP

Avg. Ramp-up Rate (Tsmax to TP)

3°C/second(max)

REFLOW

Temperature(TL)

217°C

Total Time above TL (tL)

30-100 seconds

PEAK

Temperature(TP)

260°C

Time(tp)

2-5 seconds

RAMP-DOWN Rate

3°C/second(max)

Time from 25°C to Peak Temperature

8 minutes max.

Composition of solder paste

96.5Sn/3Ag/0.5Cu

Solder Paste Model

SHENMAO PF606-P26

Soldering Iron condition: Soldering iron temperature 270°C±10°C.

Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron tempera-

ture over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.