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FT240XS-R Datasheet(PDF) 33 Page - Future Technology Devices International Ltd. |
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FT240XS-R Datasheet(HTML) 33 Page - Future Technology Devices International Ltd. |
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33 / 40 page  Copyright © 2013 Future Technology Devices International Limited 33 FT240X USB 8-BIT FIFO IC Datasheet Version 1.3 Document No.: FT_000626 Clearance No.: FTDI# 259 9.3 QFN-24 Package Mechanical Dimensions Figure 9.3 QFN-24 Package Dimensions The FT240XQ is supplied in a RoHS compliant leadless QFN-24 package - WQFN(X424), with pad size 114x114. The package is lead ( Pb ) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 4.0mm x 4.0mm. The solder pads are on a 0.50mm pitch. The above mechanical drawing shows the QFN-24 package. All dimensions are in millimetres. The centre pad on the base of the FT240XQ is internally connected to GND, and the PCB should not have tracking on the top layer in this area. The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. The code XXXXXXX is the manufacturing LOT code. |
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