DocID023414 Rev 2

5/9

CPL-WBF-00D3

Package information

2

Package information



Epoxy meets UL94, V0



Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 9. Package dimensions

Figure 10. Footprint - non solder mask

defined

Figure 11. Footprint - solder mask defined

UBM: ø 220 µm

IN

OUT

CPL

ISO

GND

GND

1100 µm

(-332, +732)

(-58, +200)

(-58, -200)

(-332, -732)

(+342, -300)

(+342, +300)

200 µm

625 ± 50 µm

Copper pad diameter:

220µm recommended

180µm minimum

260µm maximum

Solder mask opening:

320µm recommended

300µm minimum

340µm maximum

Solder stencil opening:

220µm recommended

Line to connect copper pad on solder mask opening

shopuld be smaller than copper pad diameter

Solder mask opening:

220µm recommended

180µm minimum

260µm maximum

Copper pad diameter:

320µm recommended

300µm minimum

Solder stencil opening :

220µm recommended