MPC8240 datasheet(49/52 Pages) MOTOROLA

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MOTOROLA

MPC8240 Integrated Processor Hardware Specifications

Ordering Information

1.9

Ordering Information

Ordering information for the parts fully covered by this specification document is provided in Section 1.9.1,

“Part Numbers Fully Addressed by This Document.” Section 1.9.2, “Part Numbers Not Fully Addressed by

This Document,” lists the part numbers that do not fully conform to the specifications of this document.

These special part numbers require an additional document called a part number specification.

1.9.1

Part Numbers Fully Addressed by This Document

Table 20 provides the Motorola part numbering nomenclature for the MPC8240. Note that the individual

part numbers correspond to a maximum processor core frequency. For available frequencies, contact a local

Motorola sales office. Each part number also contains a revision code that refers to the die mask revision

number. The revision level can be determined by reading the Revision ID register at address offset 0x08.

1.9.2

Part Numbers Not Fully Addressed by This Document

Parts with application modifiers or revision levels not fully addressed in this specification document are

described in separate part number specifications that supplement and supersede this document. Table 21

shows the part numbers addressed by the XPC8240RXX250x part number specifications.

Throughout this document, the acronym EPIC was changed to PIC.

Throughout this document, the register name EICR was changed to ICR

Figure 2—The note numbers in the figure were renumbered to reflect the notes.

Table 7—Num 15 and 16 were updated, and Note 7 was corrected.

Figure 5 was updated to reflect the changes made in Table 7.

Section 1.7.6—Updated this section and Figure 23.

Section 1.9.1—Updated Table 20.

Section 1.9.2—Updated Table 21.

Section 1.4.1.2—Added Figure 4 and 5, Overshoot and Undershoot Voltage of PCI Interface

Section 1.5.1—Added solder ball package information for Lead free TBGA offering

Section 1.9—Added information regarding Lead free TBGA offering.

Table 20. Part Numbering Nomenclature

XPC

nnnn

nnn

Product Code

Part Identifier

Process

Descriptor

Package 1

Processor

Frequency 2

Revision Level

XPC

8240

L = 2.5 V ± 125 mV

0 to 105

°C

ZU = TBGA

V V = Lead free

TBGA

200

E: 1.3, Revision ID 0x13

Notes:

1. See Section 1.5, “Package Description,” for more information on available package types.

2. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in

this specification support all core frequencies. Additionally, parts addressed by part number specifications may

support other maximum core frequencies.

Table 19. Document Revision History (continued)

Revision

Number

Substantive Change(s)

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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