STTH5R06-Y

Characteristics

Doc ID 17655 Rev 1

5/9

Figure 13.

Thermal resistance junction to ambient versus copper surface under tab (DPAK)

Figure 11.

Junction capacitance versus

reverse voltage applied (typical

values)

Figure 12.

Thermal resistance junction to

ambient versus copper surface

C(pF)

10

100

1

10

100

1000

F=1 MHz

V (V)

R

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

D²PAK

S(Cu)(cm²)

Epoxy printed circuit board FR4

copper thickness = 35 µm

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

0

5

10

15

20

25

30

35

40

DPAK

S(Cu)(cm²)

Epoxy printed circuit board FR4

copper thickness = 35 µm