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LNBP8L Datasheet(PDF) 12 Page - STMicroelectronics

Part # LNBP8L
Description  500 mA guaranteed output current
PDF  21 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

LNBP8L Datasheet(HTML) 12 Page - STMicroelectronics

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Detailed description and application hints
LNBP8L - LNBP9L - LNBP10L - LNBP11L
12/21
Several clips can be used depending on the heat sink type:
●
Saddle clips (Figure 7) for slim heat sinks
●
U-clips (Figure 8) for thick heat sinks
●
Dedicated clips for special shaped heat sinks
Note that the thickness of the IPPAK package (2.3 +/- 0.1 mm) is similar to that of the SOT-
32 and SOT-82 (2.55 +/- 0.15 mm). The same clips can also be used for these packages.
The junction-to-ambient thermal resistance for the IPPAK can be calculated as follows:
RTH-JA = RTH-JC + RTH-CH + RTH-HA
where: RTH-JC is the junction-to-case thermal resistance of the IPPAK (see Table 4: Thermal
data
), RTH-CH is the case-to-heat sink thermal resistance and the RTH-HA is the heat sink-to-
air thermal resistance.
Figure 7.
IPPAK mounted with a saddle clip.
Figure 8.
IPPAK mounted with a U-clip.



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