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ST72561AR7-Auto Datasheet(PDF) 304 Page - STMicroelectronics

Part # ST72561AR7-Auto
Description  Clock, reset and supply management
PDF  324 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72561AR7-Auto Datasheet(HTML) 304 Page - STMicroelectronics

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Package characteristics
ST72561-Auto
304/324
Doc ID 12370 Rev 8
Figure 150. 64-pin low profile quad flat package (10 x10)
21.3
Thermal characteristics
21.4
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in Figure 151.
Dim.
mm
inches
Min
Typ
Max
Min
Typ
Max
A
1.60
0.063
A1
0.05
0.15
0.002
0.006
A2
1.35
1.40
1.45
0.053
0.055
0.057
b
0.17
0.22
0.27
0.007
0.009
0.011
c
0.09
0.20
0.004
0.008
D
12.00
0.472
D1
10.00
0.394
E
12.00
0.472
E1
10.00
0.394
e
0.50
0.020
q
0°
3.5°
7°
0°
3.5°
7°
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1.00
0.039
Number of Pins
N64
A
A2
A1
c
θ
L1
L
E
E1
D
D1
e
b
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to
ambient)
LQFP64
LQFP44
LQFP32
60
52
70
°C/W
PD
Power dissipation(1)
1.
The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation
of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip
internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the
application.
500
mW
TJmax
Maximum junction temperature(2)
2.
The maximum chip-junction temperature is based on technology characteristics.
150
°C



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