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ST72561AR7-Auto Datasheet(PDF) 323 Page - STMicroelectronics |
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ST72561AR7-Auto Datasheet(HTML) 323 Page - STMicroelectronics |
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323 / 324 page  ST72561-Auto Revision history Doc ID 12370 Rev 8 323/324 23-Jun-2006 5 Replaced TQFP with LQFP packages throughout document Changed device summary on Table 2: Product overview Changed Section 8.2.1: Input modes Changed title of Section 8.4: I/O port register configurations from “I/O Port Implementation” to “I/O Port Register Configurations” Changed Master mode operation Corrected name of bit 5 in SPICSR register in Table 59: SPI register map and reset values Changed Section 20.5.2: PLL characteristics Added links to Table 111: Absolute maximum ratings and Table 112: Electrical sensitivities in Section 20.8.3: Absolute maximum ratings (electrical sensitivity) Removed EMC protection circuitry in Figure 136: RESET pin protection when LVD is disabled (device works correctly without these components) Changed Section 20.12.1: SPI - serial peripheral interface Changed title of Figure 147: 64-pin low profile quad flat package (14x14) Changed title of Figure 148: 32-pin low profile quad flat package (7x7) Changed title of Figure 149: 44-pin low profile quad flat package (10x10) Changed notes in Table 21.3: Thermal characteristics Changed AFI mapping for Option byte 1 Changed Figure 154: ST72561xxx-Auto ROM commercial product structure, Figure 153: ST72P561xxx-Auto FastROM commercial product structure and Figure 152: ST72F561xxx-Auto Flash commercial product structure Changed Section 20.12.1: SPI - serial peripheral interface Deleted Section 15.1.5 “Clearing active interrupts outside interrupt routine” (text already exists in Section 24.1.2: Clearing active interrupts outside interrupt routine) Added Section 24.1.5: Header time-out does not prevent wake-up from mute mode 11-Mar-2008 6 Removed ‘F’ from root part numbers and removed references to ‘automotive only’ devices in the Table 2: Product overview Removed ‘mcu’ from the URL reference in ST72561-Auto MICROCONTROLLER OPTION LIST and Chapter 23: Development tools Removed section on “SOLDERING AND GLUEABILITY INFORMATION” and replaced with Section 21.4: Packaging for automatic handling Removed references to standard device temperature codes from Figure 154: ST72561xxx-Auto ROM commercial product structure, Figure 153: ST72P561xxx- Auto FastROM commercial product structure and Figure 152: ST72F561xxx-Auto Flash commercial product structure Made small editing changes throughout document to improve readability 02-Aug-2010 7 Updated following figures: – Figure 152: ST72F561xxx-Auto Flash commercial product structure – Figure 153: ST72P561xxx-Auto FastROM commercial product structure – Figure 154: ST72561xxx-Auto ROM commercial product structure Added Chapter 21.4: Packaging for automatic handling 03-Jan-2011 8 Reinstated : Chapter 17: beCAN controller (beCAN) Table 129. Document revision history (continued) Date Revision Changes |
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