STM32F302XD datasheet(139/168 Pages) STMICROELECTRONICS

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STM32F302xD STM32F302xE

Electrical characteristics

146

Figure 51. Typical connection diagram using the ADC

1. Refer to Table 79 for the values of RAIN.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this,

fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 12. The 10 nF capacitor

should be ceramic (good quality) and it should be placed as close as possible to the chip.

6.3.20

DAC electrical specifications

Table 86. DAC characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

VDDA

Analog supply voltage

2.4

3.6

RLOAD(1)

Resistive load

DAC output buffer ON

Resistive load

Dac output buffer ON:

connected to VSSA

Dac output buffer ON:

connected to VDDA

RO(1)

Output impedance

DAC output buffer OFF

CLOAD(1)

Capacitive load

DAC output buffer ON

VDAC_OUT (1)

Voltage on DAC_OUT

output

Corresponds to 12-bit input

code (0x0E0) to (0xF1C) at

VDDA = 3.6 V

and (0x155) and (0xEAB) at

VDDA = 2.4 V DAC output

buffer ON.

0.2

VDDA – 0.2

DAC output buffer OFF

0.5

VDDA - 1LSB

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