Schematic diagram and pad configuration

JTS393

4/10

DocID025633 Rev 1

Wafer dimension: 6 inches.

Die size without scribe line:

•

X = 1326.0 µm

•

Y = 926.0 µm

Scribe line: 60 µm

Bond pad opening 109 x 109 µm

Table 1. Pad coordinates (pad placement origin is the lower left corner of the die)

Pad number

Pad description

Center pad coordinates

X (µm)

Y (µm)

1

Output 1

165

870.3

2

Inverting input 1

165

575.3

3

Non-inverting input 1

165

140.3

4

Vcc-

695

140.3

5

Non-inverting input 2

1225

140.3

6

Inverting input 2

1225

575.3

7

Output 2

1225

870.3

8

Vcc+

835

870.3