M95040-DF datasheet(42/46 Pages) STMICROELECTRONICS

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Package mechanical data

M950x0-W M950x0-R M950x0-DF

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DocID6512 Rev 13

Figure 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, outline

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed

to be connected to any other voltage or signal line on the PCB, for example during the soldering process.

3. The circle in the top view of the package indicates the position of pin 1.

Table 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, data

Symbol

Millimeters

Inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Typ.

Min.

Max.

Typ.

Min.

Max.

0.550

0.450

0.600

0.0217

0.0177

0.0236

0.020

0.000

0.050

0.0008

0.0000

0.0020

0.250

0.200

0.300

0.0098

0.0079

0.0118

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

1.200

1.600

0.0472

0.0630

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

1.200

1.600

0.0472

0.0630

0.500

0.0197

K (rev MC)

0.300

0.0118

0.300

0.500

0.0118

0.0197

0.150

0.0059

0.300

0.0118

eee(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.080

0.0031

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