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ST6G3244ME Datasheet(PDF) 1 Page - STMicroelectronics |
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ST6G3244ME Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 27 page ![]() November 2011 Doc ID 022157 Rev 2 1/27 1 ST6G3244ME Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection Features ■ Supports 60 MHz clock rate ■ Supports DDR mode for SD Card™ ■ Compliant with – SD Specification Part 1 Physical Layer Specification 3.00 (SDR12, SDR25, DDR50) – SD Specification Part 1 Physical Layer Specification 2.00 ■ Bi-directional with direction control pin ■ Balanced propagation delays: tPLH ≈ tPHL ■ LDO power-down support. When the LDO is powered down, VCCB is pulled to GND via the 130 Ω resistor. When VCCB = 0 V, there is no additional leakage seen on VCCA. ■ EMI filtering and signal conditioning ■ Supports both 1.8 V and 2.9 V data translation on card side ■ Integrated LDO to supply 1.8 V or 2.9 V power for B-side I/Os (pin-selectable); can be used also externally ■ Integrated pull-up and pull-down resistors on B-side ■ Operating voltage range –VCCA = 1.62 V to 1.98 V –VBAT = 3.0 V to 5.0 V ■ Latch-up performance exceeds 100 mA (JEDEC Standard 78) ■ ESD protection for card side (B-port, CD and WP pins) – ±8 kV contact discharge (IEC61000-4-2) – ±15 kV air-gap discharge (IEC61000-4-2) ■ ESD protection for host side (A-side) – ±2 kV HBM (JEDEC 22-A114) – ±200 V MM (JEDEC 22-A115) ■ Operating temperature range –40 °C to +85 °C ■ Space-saving Flip Chip 25 package (2 x 2 x 0.605 mm, 0.4 mm bump pitch) ■ RoHS compliant, lead-free soldering capable Applications ■ Mobile phones, smartphones ■ PDAs ■ Cameras ■ SD Card readers ■ Any device with SD memory card Table 1. Device summary Order code Package Packing Package topmark ST6G3244MEBJR Flip Chip 25 2 x 2 x 0.605 mm, 0.4 mm bump pitch Tape and reel (5000 parts per reel) VKH, VKV Flip Chip 25 www.st.com |
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