High Accuracy, Galvanically Isolated Current Sensor IC

With Small Footprint SOIC8 Package

ACS722

21

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

Figure 6: Package LC, 8-pin SOICN

C

1.27 BSC

A

B

B

C

2

1

8

Branding scale and appearance at supplier discretion

C

SEATING

PLANE

C

0.10

8X

0.25 BSC

1.04 REF

1.75 MAX

1.75

4.90 ±0.10

3.90 ±0.10

6.00 ±0.20

0.51

0.31

0.25

0.10

0.25

0.17

1.27

0.40

8°

0°

A

Standard Branding Reference View

2

1

1

8

C

0.65

1.27

5.60

Branded Face

For Reference Only – Not for Tooling Use

(Reference MS-012AA)

Dimensions in millimeters – NOT TO SCALE

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

SEATING PLANE

GAUGE PLANE

PCB Layout Reference View

NNNNNNN

TPP-AAA

LLLLL

N = Device part number

T= Device temperature range

P= Package Designator

A= Amperage

L= Lot number

Belly Brand = Country of Origin

Terminal #1 mark area

Reference land pattern layout (reference IPC7351 SOIC127P600X175-8M);

all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary

to meet application process requirements and PCB layout tolerances

Package Outline Drawing