STCD22X0 datasheet(27/39 Pages) STMICROELECTRONICS

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STCD22x0, STCD23x0, STCD24x0

Maximum ratings

Doc ID 15400 Rev 2

27/39

Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 8.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC off)

–55 to 150

°C

TSLD

(1)

Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead-free bump solder temperature for 10 seconds

260

°C

Maximum junction temperature

150

°C

VCC

Supply voltage

–0.3 to 6

VIN

Input clock voltage

–0.3 to 3.6

VEN

Voltage on enable pins

–0.3 to 3.6

VOPT

Optional pins voltage

–0.3 to 6

MCREQ

Master clock request

–0.3 to 3.6

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