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TS2012EI Datasheet(PDF) 28 Page - STMicroelectronics

Part # TS2012EI
Description  Filter-free Flip Chip stereo 2 x 2.5 W class D audio power amplifier
PDF  32 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TS2012EI Datasheet(HTML) 28 Page - STMicroelectronics

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Package information
TS2012EI
28/32
DocID026152 Rev 1
5
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 41. Flip Chip 16 package mechanical drawing
Die size: 2.07 x 2.07 mm ± 50 µm
Die height (including bumps):
600 µm
Bump diameter: 315 µm ±50µm
Bump diameter before reflow:
300 µm ±10µm
Bump height: 250 µm ±40 µm
Die height: 350 µm ±20µm
Pitch: 500 µm ±50 µm
Bump Coplanarity: 60 µm max
Optional*: back coating height:
40 µm
500
m
2.1 mm
2.1 mm
600
m
40
m*
G1
INL+
250
m
500
m
2.1 mm
2.1 mm
600
m
40
m*
G1
INL+
250
m
2.07mm
2.07 mm



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