EHA-L50L50-R01-L1 datasheet(3/4 Pages) VIMARLOW

3 / 4 page

EHA-L37L37-R01-L1 or EHA-L50L50-R01-L1

DOC # 102-0389 REV 3 - PAGE 3 OF 4

Vout OPTIONS

GND1 (PIN 2), GND2 (PIN 4)

Ground pin.

VLDO (PIN 3)

Output of the 2.2V Low Drop Out (LDO). The LTC3108

includes a low current LDO to provide a regulated 2.2V output

for powering low power processors and other low power ICs.

The LDO output is current limited to 4mA.

PGD (PIN 5)

Power good output that monitors the VOUT voltage. The PGD

output is designed to drive a microprocessor or other chip I/O

and is not intended to drive a higher current load such as an

LED. When VOUT is within 7.5% of its programmed value, PGD

will be pulled up to VLDO through a 1MΩ resistor. If VOUT

drops 9% below its programmed value PGD will go low.

VSTORE (PIN 6)

Output for the storage capacitor or battery.

The VSTORE

output can be used to charge a large storage capacitor or

rechargeable battery. The storage element on VSTORE can

be used to power the system in the event that the input

source is lost or is unable to provide the current demanded by

VOUT and LDO output. A large capacitor may be connected

from this pin to GND for powering the system in the event the

input voltage is lost. It will be charged up to 5.25V. Note

that it may take a long time to charge a larger capacitor,

depending on the input energy available and the loading on

VOUT and VLDO. Since the maximum current from VSTORE is

limited to a few milliamps, it can safely be used to trickle-

charge NiCd or NiMH rechargeable batteries for energy

storage when the input voltage is lost. Note that the VSTORE

capacitor cannot supply large pulse currents to VOUT. Any

pulse load on VOUT must be handled by the VOUT capacitor. If

not used, this pin should be left open.

THOT, TCOLD (PINS 7-10)

Thermistor leads for hot side and cold side TEG temperatures.

The temperature readings from the on-board thermistors

monitor the hot side and cold side of the embedded TEG. In

application, these temperatures will be different than the

source and sink temperatures used to define the system

temperature difference included in the performance plot. The

following figure shows how thermal resistance on either side

of the TEG can affect temperatures. It is recommended that

the

user

place

and

monitor

external

thermocouples/thermisters/RTD’s on both the heat source

and heat sink (or ambient conditions) in addition to

monitoring the on-board thermistors.

Manufacturer: GE Industrial Sensing (Thermometrics)

PN: A040A-UBCF16XF103X-A

Resistance at 25°C: 10 KOhm +/- 0.20%

β 25/100: 3992 K +/- 1%







 

298

3992

ln 10

298

ln 10













where R is the resistance of the thermistor that you want to

measure and T is the temperature of the thermistor.

APPLICATION NOTES

VOUT and VSTORE Capacitor

For pulsed load applications, the VOUT capacitor should be

sized to provide the necessary current when the load is

pulsed on. The capacitor value required will be dictated by

the load current, the duration of the load pulse, and the

amount of voltage drop the circuit can tolerate. The capacitor

must be rated for the voltage selected for VOUT by VS1 and

VS2.



  









Load

Pulse

out

OUT

ImA t

∆ VOUT is the maximum allowable voltage drop on VOUT. Note

that there must be enough energy available from the input

voltage source for VOUT to recharge the capacitor during the

interval between load pulses. Reducing the duty cycle of the

VS1

VS2

VOUT

GND

2.35V

VAUX

GND

3.3V

GND

VAUX

4.1V

VAUX

Converter

VSTORE

VLDO

VOUT

PGD

GND

µP

SENSORS

RF LINK

TEG

220µF

2.2µF

CUSTOMER

ADDITION

EHA-L50L50-R01-L1 Datasheet(PDF) 3 Page - II-VI Marlow, Inc.

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