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LMV232TL Datasheet(PDF) 11 Page - National Semiconductor (TI) |
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LMV232TL Datasheet(HTML) 11 Page - National Semiconductor (TI) |
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11 / 13 page ![]() Application Notes (Continued) The pedestal voltage at 25˚C is subtracted from the output voltage of each curve. Variations of the pedestal voltage over temperature are thus included in the error. The pedestal voltage variation itself consists of 2 error sources. One is the variation of the reference voltage V REF. The other is an offset current I OS that is generated inside the detector. This depicted in Figure 4. Depending on the mea- surement strategy one or both error sources can be elimi- nated. The error sources of the pedestal voltage can be shown in a formula for V OUT: V OUT =VREF +(IOS +IDET)*RFB Where I DET represents the intended detector output signal. In the absence of RF input power I DET equals zero. The formula for the pedestal voltage can therefore be written as: V PEDESTAL =VREF +IOS *RFB For low input power levels, the pedestal variation V PEDESTAL is the dominant cause of error. Besides temperature varia- tion of the pedestal voltage, which limits the lower end of the range, the pedestal voltage can also vary from part-to-part. By applying a suitable measurement strategy, the pedestal voltage error contribution can be significantly reduced or eliminated completely. POWER MEASUREMENT STRATEGIES This section describes the measurement strategies to re- duce or eliminate the pedestal voltage variation. Which strat- egy is chosen depends on the possibilities for a factory trim and implementation of calibration procedures. Since the pedestal voltage is the reference level for the LMV232, it needs to be calibrated/measured at least once to eliminate part-to-part spread. This is required to determine the exact detector output signal. Because of process toler- ances, the absolute part-to-part variation of the output volt- age in the absence of RF input power will be in the order of 5 - 10%. All measurement strategies discussed eliminate this part-to-part spread. Strategy 1: Elimination of Part-to-Part Spread at Room Temperature Only In this strategy, the pedestal voltage is determined once during manufacturing and stored into the memory of the phone. At each power measurement this stored pedestal level is digitally subtracted from the measured output signal of the LMV232 during normal operation. The procedure is thus: • Measure the detector output in the absence of RF power during manufacturing. • Store the output voltage value in the cell phone memory (after it is analog-to-digital converted). • Subtract the stored value from each detector output read- ing. The advantage of this strategy is that calibration is required only once during manufacturing and not during normal op- eration. The disadvantage is the fact that this method neither compensates for the residual temperature drift of the refer- ence voltage V REF nor for offset current variations. Only part-to-part variations at room temperature are eliminated by this strategy. Especially the residual temperature drift nega- tively affects the measurement accuracy. Strategy 2: Elimination of Temperature Spread in V REF If software changes need to be reduced to a minimum and the baseband chip has a differential ADC, strategy 2 can be used to eliminate temperature variations of the reference voltage V REF. One pin of the ADC is connected to FB and one is connected to OUT (Figure 6). The power measurement is independent of the reference voltage V REF, since the ADC reading is: V OUT-VFB =(IOS +IDET)*RFB 20127805 FIGURE 4. Pedestal Voltage 20127806 FIGURE 5. Strategy 1: Room Temperature Calibration 20127807 FIGURE 6. Strategy 2: Differential Measurement www.national.com 11 |
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