 2004 Microchip Technology Inc.

DS21893A-page 21

MCP73861/2

16-Lead Plastic Quad Flat No Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated

2

1

n

D

E

E1

D1

e

b

L

A

A1

A3

EXPOSED

METAL

PAD

OPTIONAL

INDEX

AREA

Contact Width

*Controlling Parameter

Drawing No. C04-127

Notes:

JEDEC equivalent: MO-220

b

.010

.012

.014

0.25

0.30

0.35

Pitch

Number of Pins

Overall Width

Standoff

Overall Length

Overall Height

MAX

Units

Dimension Limits

A1

D

E

n

e

A

.000

INCHES

.026 BSC

MIN

16

NOM

MAX

.002

0.00

4.00

MILLIMETERS*

.039

MIN

16

0.65 BSC

NOM

0.05

1.00

0.90

.035

.001

0.02

Contact Length

L

.012

.016

.020

0.30

0.40

0.50

E2

D2

Exposed Pad Width

Exposed Pad Length

.100

.106

.110

2.55

2.70

2.80

.031

0.80

3.85

4.15

.163

.157

.152

.152

.157

4.00

.163

3.85

4.15

.100

.106

2.70

.110

2.55

2.80

Revised 04-24-05

Contact Thickness

A3

.008 REF

0.20 REF

TOP VIEW

BOTTOM VIEW