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RT5028C Datasheet(PDF) 21 Page - Richtek Technology Corporation

Part # RT5028C
Description  Integrated PMIC
PDF  41 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT5028C Datasheet(HTML) 21 Page - Richtek Technology Corporation

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21
DS5028C-03
September 2016
www.richtek.com
RT5028C
©
Copyright
2016 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
EEPROM (MTP) Control Flow
The RT5028C embeds 32 bytes MTP memory, and it allows
users to save some I
2C register bank data to MTP. When
the I
2C register 0x3A Bit[0]/Bit[1] is wrote to
“1”, the
MTP Page1/Page2 will execute erase process firstly.
Because the erase process will be done in every writing
time, the MTP data will be missed. So it would be best
for users to read data from MTP to I2C first before
executing writing process.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and
θJAis the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125
°C. The junction to
ambient thermal resistance,
θJA, is layout dependent. For
WQFN-56L 7x7 package, the thermal resistance,
θJA, is
27
°C/W on a standard JEDEC 51-7 four-layer thermal test
board. The maximum power dissipation at TA = 25
°C can
be calculated by the following formula :
PD(MAX) = (125
°C − 25°C) / (27°C/W) = 3.7W for
WQFN-56L 7x7 package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance,
θJA. The derating curve in Figure 1 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Figure 1. Derating Curve of Maximum Power Dissipation
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB
Set I
2C Register 0x3A Bit[4] =1
PMU will read MTP data to
relative I
2C register bank.
Set I
2C Register 0x3A Bit[0]
PMU will erase the MTP page1
data
PMU will move relative I
2C
register bank data to MTP
Reading MTP process
Writing MTP process
Page 1 writing follow :
Set I
2C Register 0x3A Bit[5] =1
PMU will read MTP data to
relative I
2C register bank.
Set I
2C Register 0x3A Bit[1]
PMU will erase the MTP page2
data
PMU will move relative I
2C
register bank data to MTP
Reading MTP process
Writing MTP process
Page 2 writing follow :



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