AD7989-1BCPZ-R2 datasheet(22/24 Pages) AD

22 / 24 page

AD7989-1/AD7989-5

Data Sheet

Rev. B | Page 22 of 24

OUTLINE DIMENSIONS

Figure 41. 10-Lead Mini Small Outline Package [MSOP]

(RM-10)

Dimensions shown in millimeters

Figure 42. 10-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-10-9)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-187-BA

6°

0°

0.70

0.55

0.40

0.50 BSC

0.30

0.15

1.10 MAX

3.10

3.00

2.90

COPLANARITY

0.10

0.23

0.13

3.10

3.00

2.90

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

2.48

2.38

2.23

0.50

0.40

0.30

0.25

0.20

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.74

1.64

1.49

0.20 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

TOP VIEW

BOTTOM VIEW

0.20 MIN

AD7989-1BCPZ-R2 Datasheet(PDF) 22 Page - Analog Devices

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