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ST72324BL Datasheet(PDF) 137 Page - STMicroelectronics |
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ST72324BL Datasheet(HTML) 137 Page - STMicroelectronics |
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137 / 151 page ![]() ST72F324L, ST72324BL 137/151 PACKAGE MECHANICAL DATA (Cont’d) Figure 84. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width 13.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) TQFP44 10x10 TQFP32 7x7 SDIP32 200mil 52 70 50 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C Dim. mm inches Min Typ Max Min Typ Max A 3.56 3.76 5.08 0.140 0.148 0.200 A1 0.51 0.020 A2 3.05 3.56 4.57 0.120 0.140 0.180 b 0.36 0.46 0.58 0.014 0.018 0.023 b1 0.76 1.02 1.40 0.030 0.040 0.055 C 0.20 0.25 0.36 0.008 0.010 0.014 D 27.43 28.45 1.080 1.100 1.120 E 9.91 10.41 11.05 0.390 0.410 0.435 E1 7.62 8.89 9.40 0.300 0.350 0.370 e 1.78 0.070 eA 10.16 0.400 eB 12.70 0.500 eC 1.40 0.055 L 2.54 3.05 3.81 0.100 0.120 0.150 Number of Pins N 32 D b2 b e A A1 A2 L E1 E eC C eA eB 1 |
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