Philips Semiconductors

TDA8947J

4-channel audio amplifier

Preliminary data

Rev. 01 — 06 February 2004

21 of 24

9397 750 10779

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

16. Soldering

16.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth

account of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC

packages on a printed-circuit board.

16.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder

pastes is increasing. Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250

°C or 265 °C, depending on solder material applied, SnPb or

Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the

If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

16.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron

bit is less than 300

°C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400

°C, contact may be up to 5 seconds.

16.4 Package related soldering information

[1]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[2]

For PMFP packages hot bar soldering or manual soldering is suitable.

Table 12:

Suitability of through-hole mount IC packages for dipping and wave

soldering methods

Package

Soldering method

Dipping

Wave

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable

suitable[1]

PMFP[2]

−

not suitable